We are here to guide our clients with the secure payment procedures. With us, the customers get convenience to pay through both online and offline payment methods Only quality packaging material has been used for the packing of the products that we offer. Moreover, the entire packaging procedure is conducted under the supervision of the experts.
General Information:
- Base Material: OFHC, Tungsten Copper, GLIDCOP, Molybdenum
- With BeO substrate: W85Cu15+BeO, W85Cu15+BeO+Mo, OHFC+Mo+BeO+Mo
- Pin Material: Copper-cored Kovar, ZrCu
Manufacturing Standard:
- Complied with MIL-PRF-19500, MIL-STD-883 and screened/tested per MIL-PRF-38354
- Performance and Reliability:
- Hermeticity: ≤1X10-8 ATM(He) cc/Sec
- Isolation Resistance: ≥109Ω
- Temperature Cycle: -65-+175 500 times
- Thermal Shock: -6515015times
- Moisture Proof Test: Comply with MIL-PRF-19500,10 times Cycle
